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| This is the simplified resist coat/develop system that is applicable to all categories of wafer production processes. |
| Major Functions |
| With its manual operation, this system can still be equipped with various options including a chemical filter, resist temperature controller, developer temperature controller, and atmosphere temperature controller and humidity controller in the coating chamber. This is the highly flexible high-performance system which can accommodate up to the maximum of 300 mm in diameter for substrate size and also handle irregular substrates. The system permits a free combination of the number of resist lines, number of developer lines, and BSR (Back Side Rinse)/EBR (Edge Bead Remover). |
| Lineup |
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●Model LSC-800C
Manual resist coat system
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●Model LSC-800D
Manual develop system
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●Model LSC-Qz1
Manual resist coat system for very small substrates
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●Model LSC-400C
Low-cost manual resist coat system with simple specifications
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●Model LSC-400D
Low-cost manual develop system with simple specifications
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