This is the manual bake/cooling system adopting the high-precision bake plate and high-precision cooling plate installed in the automatic resist coat/develop/bake system, LITHOTRAC series.
Major Functions
Process gas is evenly purged onto a substrate from the inner side of the upper lid to protect the substrate being baked against contamination. The system is also structured not to allow outgas generated in baking to be released into the clean room through uniform exhaust. This is the highly flexible high-performance system which can accommodate up to the maximum of 300 mm in diameter for substrate size and also handle irregular substrates.
Lineup
●Model LWB-03P
(Manual Bake/Cooling System)
This system readily permits high-precision baking and high-precision cooling. It can be equipped with a substrate transfer system between baking and cooling.
●Model LWB-03
(Manual Bake System)
This system readily permits high-precision baking. Model LWB-03H is also available to control a high temperature (400°C).
●Model APPS-30
(Single Wafer Type Manual HMDS Processing System)
This system readily permits HMDS processing by single wafer.
●Model APPS-40
(Batch Type Manual HMDS Processing System)
You can manually set the substrate carrier (8-inch carrier) in the vacuum bake oven and readily carry out HMDS processing.
